Delay With Production of Hidizs AP200

On Tuesday Hidizs partly explained the reason for the AP200 delay in a post on Head-Fi:

Dear valued backers,

We mentioned in the previous updates that shipment is going to start shortly; unfortunately, due to the unforeseen circumstances have delayed the production of the Hidizs, only 163 orders have been shipped out so far. It pains us to know that we may have disappointed you, please accept our sincere apology for the delay.

The main reason for the delay in production is the demanding craftsmanship of the stainless steel CNC process. Since this advanced machinery is rarely used in HiFi player or mobile phones; even a killer brand like Apple has only applied it to the latest iPhone X; it is not difficult to imagine the sophisticated craftsmanship required in CNC process. Sturdiness is the pro and con of stainless steel, with the high degrees of sturdiness, various issues have been found in Hidizs mould, resulting in the production delay.

Over the past few weeks, our engineers have been working days and nights to grasp the progress status; and only until yesterday, over hundreds of stainless steel cases have finally passed the quality assurance test. As the production of the aluminium alloy is gradually completed; the shipping speed is expected to accelerate.

It is believed that 500-800 orders will be shipped out this week, and relevant tracking number will be sent to your email shortly. We truly appreciate your support, once again, we apologise for any inconvenience and disappointment caused.

Thank You, 

Hidizs Team

Unfortunately, delays do happen, but hopefully the AP200 delay won’t be something that holds Hidizs back for much longer and they’ll be able to sort this issue out soon and get their much anticipated device out to customers.

What is the AP200?

If, for whatever reason, you’re unfamiliar with the AP200, here’s the deal.

The AP200 is the much anticipated upcoming flagship from Hidizs. It’s a first foray into the world of Android-based DAPs for Hidizs, and also sports some pretty impressive specs under the hood.

OS processing will be taken care of a Rockchip Cortex-A9 1.4GHz quad core cpu, along with 1GB of RAM.
Size-wise it has a footprint of 2.28 x 4.17-inch, making it around 9% smaller than Fiio’s X3 Mark III, and nearly identical to that of the Q1 Mark II.
For the display Hidizs as opted for a 3.54-inch IPS touch-panel with a resolution of 960×640, giving theAP200 a pixel density of 325PPI. That’s a higher pixel density than the Shanling M2s (which currently has the highest pixel density of any DAP), and just about equal to the iPhone 8!

As far as audio processing is concerned, the AP200 will house not one, but dual ES9118 DAC chips capable of decoding up to DSD128 and 384kHz/32-bit PCM.


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